Silicone based thermal conductive gap filling material
time : 03-09-2024 13:13:48  


With high thermal conductivity, low interfacial thermal resistance and good thixotropy, it is an ideal material for applications with large gap tolerances

Fill between the electronic components that need to be cooled and the radiator/shell to make close contact, reduce thermal resistance, reduce the temperature of electronic components quickly and effectively, thereby extending the service life of electronic components and improving their reliability. Coating can be done manually or through dispensing equipment

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